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    Design Assistant Engineer (Japanese s...

    Date: Nov 14, 2018
    Company: Manufacturing company
    Salary: Up to US$10,000 Location: Malaysia
    Job Description o Customer claim investigation o Translate and project o Company activity Requirement Language: English, Japanese Education Background: Diploma/ Degree in Mechanical / Electrical/ Eng ...
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    -New Product Introduction- NPI Proces...

    Date: Nov 14, 2018
    Company: Semiconductor Company
    Salary: Up to US$10,000 Location: Malaysia
    Job Responsibilities: - New product introduction (NPI), setup and qualification of new process/new machines - Working with cross functional departments to run sample builds (ES/Qual/CS) on specific pr ...
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    R&D Process Developer (Senior)

    Date: Nov 14, 2018
    Company: Semiconductor Company
    Salary: US$10,000 - US$20,000 Location: Malaysia
    Job Responsibilities: - Semiconductor discrete package design and development - Characterize and qualify new material (e.g.: solder paste, mold compound, etc) for power discrete packages - Characteriz ...
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    R&D Package Developer (Junior)

    Date: Nov 14, 2018
    Company: Semiconductor Company
    Salary: Up to US$10,000 Location: Malaysia
    Job Responsibilities: - Semiconductor discrete package design and development - Package research and (Mechanical/Electrical) characterization - Package Leadframe and Clip Design and design rule develo ...
  • UP Job
    Post

    -New Product Introduction- NPI Produc...

    Date: Nov 14, 2018
    Company: Semiconductor Company
    Salary: Up to US$10,000 Location: Malaysia
    Job Responsibilities: - New product introduction (NPI), setup and qualification of new process/new machines - Working with cross functional departments to run sample builds (ES/Qual/CS) on specific pr ...
  • UP Job
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    【JP speaker】production engineering (e...

    Date: Nov 14, 2018
    Company: Manufacturing company
    Salary: Up to US$10,000 Location: Malaysia
    Job Description We have developed, manufactured and marketed around 40,000 types of electronic component. Supplied to around 2,000 corporate customers worldwide, these high-value electronic components ...
  • UP Job
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    R&D Package Developer (Senior)

    Date: Nov 14, 2018
    Company: Semiconductor Company
    Salary: US$10,000 - US$20,000 Location: Malaysia
    Job Responsibilities: - Semiconductor discrete package design and development - Package research and (Mechanical/Electrical) characterization - Package Leadframe and Clip Design and design rule develo ...
  • UP Job
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    Senior Technologist (Materials Develo...

    Date: Nov 14, 2018
    Company: Semiconductor company
    Salary: US$50,000 - US$80,000 Location: Singapore
    Job Description Define, design, develop, and deliver technological solutions to assembly. Start-up Materials Characterization Lab in which synthesis and characterization of materials. Work with suppl ...
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    Manufacturing System Design Engineer

    Date: Nov 14, 2018
    Company: Semiconductor company
    Salary: Up to US$40,000 Location: Singapore
    Job Description Solve system integration issues on wafer inspection tools Develop product specifications based on system requirement Involve in product development Provide fix support on field escala ...
  • UP Job
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    Manufacturing Design Engineer

    Date: Nov 14, 2018
    Company: Semiconductor company
    Salary: Up to US$40,000 Location: Singapore
    Job Description Solve motion system integration issues on wafer inspection tools Develop product specifications based on system requirement Involve in product development Provide fix support on field ...

Results  1 - 10  of  63